"J" Is For Judgment PDF Free Download

admin 10/11/2021
  1. " J" Is For Judgment Pdf free. download full
  2. " J" Is For Judgment Pdf Free Download Torrent
Pdf

Open PDF file, 427.8 KB, for Application Under Rule 33(a) for Entry of Judgment (PDF 427.8 KB) Form BMC-CV-009 (Rev. 6/10) Open PDF file, 241.17 KB, for Certification of Compliance with Rule 5 of the SJC Uniform Rules of Dispute Resolution (PDF 241.17 KB). Download Free PDF. Download Free PDF. THE MYTHOLOGY OF ALL RACES, Volume 7, Armenian (By: MARDIROS H. ANANIKIAN) and African Mythologies, Editorial group, 1925. Moumdjian, Ph.D. Download with Google Download with Facebook. Create a free account to download. Download Full PDF.

"J"

Lutowanie - poradnik dla początkujących (nie SMD)

Z poradników i materiałów znalazłem takie coś. Sądze że przyda się początkującym.

  • Solder instructions.rar
    • 4.09.145 Teleplan Soldering Guidelines.pdf
    • Service Profile for Lead Free.doc

Download file - link to post
"J" Is For Judgment PDF Free Download

Solder instructions.rar > 4.09.145 Teleplan Soldering Guidelines.pdf

Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
Teleplan
Component Soldering
and Placement Guidelines
for Rework Operators
These Guidelines Are Drawn Up In Accordance With IPC 7711
1
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
CONTENTS
l.
INTRODUCTION.
2.
GLOSSARY OF TERMS.
3.
COMPONENT IDENTIFICATION.
4.
CHIPS.
5.
MELFS.
6.
LCCS.
7.
" J " & " V " LEADS.
8.
FLAT LEADS.
9.
TANTALUM CAPACITORS.
10.
SOT.
11.
" I " LEADS.
12.
SOLDER JOINT INTEGRITY - DEFECT CRITERIA.
2
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
INTRODUCTION
In conventional board assembly technology, the component leads are inserted into
the holes through the PCB and connected to the pads by solder. Either
wave
solder or hand soldering can be used.
In Hybrid circuits " chips " i.e. leadless components are reflow soldered onto ceramic
or glass substrate in addition to the components already integrated on the
substrate.
Surface mounting evolved from these two techniques.
In thru hole technology, the components are placed on one side of the PCB and
soldered from the other, whereas in surface mount technology the components can
be assembled on both sides of the board. The components are attached to the
PCB by solder paste or non-conductive glue and then soldered.
In the near future mixed assemblies i.e., a combination of leaded and surface
mounted components will prevail since not yet all component types are available as
surface mount version.
In some cases the components are non-conductively glued to the PCB before
soldering.
Automatic assembly machines are a must for an expedient production.
COMPONENTS
Components for surface mounting have to withstand high thermal stress during the
soldering procedure. Not all component types meet these requirements; therefore
new components suitable for surface mounting are constantly developed.
SMD's (Surface Mounting Devices) are much smaller than leaded components,
thus enabling smaller board size, higher packing density, reduced storage space
and finally smaller equipment can be obtained.
The light weight makes them ideal for mobile appliances and no lead means high
resistance to shock and vibration. No leads mean that no bending and cutting is
required.
The growing demand for SMD's results in lower production costs, so that further
cost reductions can be anticipated.
PRINTED CIRCUIT BOARD
Surface mount technology makes PCB's smaller; when using SMD's on both sides
for example the size can be reduced by 50%.
Surface mount technology does not require a special PCB material; standard
materials such as phenolic resin, laminated paper and glass fibre laminated epoxy
material are suitable.
3
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
The elimination of thru holes entails a further cost reduction. This is an important
factor as the cost of drilling holes can amount up to 10% of the PCB cost.
RELIABILITY
The demands on quality and reliability of PCB assemblies increase steadily. It is a
matter of fact, that in this respect SMD's have at least to meet the standard set by
conventional thru hole technology.
As surface mount technology is a relatively new development sufficient proven
information on quality and reliability is not yet available. However, the following
statements can be made. The failure rate of SMD's does not exceed that of leaded
components, omission of leads means one point of contract less.
High requirements are placed on the solderability of SMD's, the specifications for
wetting, leaching and storage have to be observed.
In many cases the soldering methods are the same as with other mounting
methods. The known advantages and disadvantages apply to surface mount
technology as well.
Surface mounting requires more careful planning of the overall design and
production process than thru hole technology. The better components PCB layout,
automatic placement, soldering method, testing and repair match each other, the
more efficiently surface mounting can be applied.
4
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
GLOSSARY OF TERMS
Following is a partial list of Terms and Definitions from ANSI/IPC-T-50D which
apply to the verbal and photographic criteria used in this Workmanship Manual.
Base Material
The insulating material upon which a conductor pattern
may be formed. (The base material may be rigid, flexible or both.
It may be a dielectric sheet or insulated metal sheet).
Basis Metal
A metal upon which coatings are deposited.
Blister
A localised swelling and separation between any of the
layers of a laminate base material, or between base
material and conductive foil or protective coating. (It is
also a form of delamination).
Bridging,
Electrical The formation of a conductive path between
conductors. (See also " Soldering Bridging " ).
Castellation
A metallized feature that is recessed on the edge of a
chip carrier used to interconnect conducting surfaces or
planes within or in the chip carrier.
Chip Carrier
A low profile surface mount component package, usually
square, whose semiconductor chip cavity or mounting
are usually on all four sides of the package. (It may be
either leaded or leadless).
Circuit
The interconnection of a number of electrical elements
and/or components performing a desired electrical
function.
Circuitry Layer
A layer of printed board containing conductors, including
ground and voltage planes.
Coined Lead
A cylindrical lead that has been formed to have parallel
surfaces approximating ribbon lead configuration
A solder connection exhibiting poor wetting and a
greyish, porous appearance due to insufficient heat,
inadequate cleaning prior to soldering, or excessive
impurities in the solder.
Cold Solder
Connection
Component
An individual part or combination of parts that, when
together, perform a design function(s).
Component Lead
The solid or stranded wire or formed conductor that
extends from a component and serves as a mechanical
or electrical connection or both.
5
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
Component Mounting
The act of attaching a component to a printed board, or
in the manner in which it is attached or both.
Conductive Pattern
The configuration or design of the conductive material on
the base material. (This includes conductors, lands, vias,
heatsinks and passive components when these are an integral part
of the printed wiring board manufacturing process).
Conductor
A single conductive path in a conductive pattern.
Conductor Spacing
The observable distance between adjacent edges of
isolated conductive patterns in a conductor layer.
(Not center-to-center spacing)
Conductor Width
The observable width of a conductor at any point chosen
at random on the printed board normally viewed from
directly above unless otherwise specified.
Connector
A
component
used
to
provide
mechanical
connect/disconnect service for electrical terminations.
Contact Angle (Solder)
The angle enclosed within the solder fillet, between a
plane tangent to the solder / basis-metal surface and a
plane tangent to the solder / air interface.
Contact Area
The common area between a conductor and a connector
through which the flow of electricity takes place.
Continuity
An uninterrupted path for the flow of electrical current in a
circuit.
Crazing
An internal condition occurring in the laminate base
material in which the glass fibres are separated from the
resin at the weave intersections. (This condition manifests
itself in the form of connected white spots or crosses below the
surface of the base material.
It is usually related to mechanicallyinduced stress). (See also " Measling " ).
Defect
Any non-conformance of the unit or product with specified
requirements.
Degradation
A decrease in the performance characteristics or service
life of an item.
Delamination
A separation between layers within a base material,
between a base material and a conductive foil, or any
planar separation within a multilayer printed board.
6
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
Dent
A smooth depression in the conductive foil which does
not significantly decrease foil thickness.
Dewetting
A condition which results when molten solder has coated
a surface and then receded leaving irregularly shaped
mounds of solder separated by areas covered with a thin
solder film; basis metal is not exposed.
Disturbed Solder
Connection
A solder connection resulting from motion between the
joined metals when the solder was solidifying.
Dual-In-Line Package
(DIP)
A component package having two rows of leads
extending from its sides and formed at right angles from
a plane parallel to its base.
Excess Solder
Connection
A solder connection characterised by the complete
obscuring of the connected metal surfaces or by the
presence of solder beyond the connection area.
Flat Pack
A component package having two rows of leads
extending from its sides and parallel to its base,
Flux
A chemically-active compound which, when heated,
removes minor surface oxidation, minimises oxidation of
the basis metal, and promotes the formation of an
intermetallic layer between solder and basis metal.
Insufficient Solder
Connection
A solder connection characterised by incomplete
coverage of one or more of the metal surfaces being
joined or by incomplete solder fillets.
Land
A portion of a conductive pattern usually used for
electrical connection, component attachment, or both.
Land Pattern
A combination of lands intended for the mounting,
interconnection and testing of a particular component.
Leaching
Solder leaching is evidenced by exposed termination frit
material or ceramic caused by prolonged time
temperatures resulting in the dissolution of the chip
termination metal into the liquid solder.
Lead
A length of insulated or uninsulated metallic conductor
used for electrical connection.
Leaded Chip Carrier
A chip carrier whose external connections consist of
leads around and down the sides of the package.
Leaded Surface
Mount Component
A surface mount component whose external connections
consist of formed leads.
7
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
Leadless Chip Carrier
A chip carrier whose external connections consist of
metallised terminations.
Leadless Surface
Mount Component
A surface mount component whose external connections
consists of metallised terminations that are an integral
part of the component body.
Lifted Land
A land that has lifted or separated from the base
material, whether or nor any resin is lifted with the land.
Measling
An internal condition occurring in laminated base material
in which the glass fibres are separated from the resin at
the weave intersection. (This condition manifests itself in the
form of discrete white spots or " crosses " below the surface of the
base material, and is usually related to thermally induced stress).
(See also " Crazing " ).
Metallization
A deposited or plated thin metallic film used for its
protective or electrical properties.
Metallization
Separation
Is evidenced by peeling away or separation of the end
termination from the component body, exposing the base
material.
Minimum Electrical
Spacing
The minimum allowable distance between adjacent
conductors that is sufficient to prevent dielectric
breakdown or corona or both between the conductors at
any given voltage and altitude.
Mixed Component
Mounting Technology
A component mounting technology that uses both
through-hole and surface mounting technologies on the
same packaging and interconnecting structure.
Mounting Hole
A hole used for the mechanical mounting of a printed
board or for the mechanical attachment of components to
the printed board.
Nick
A cut or notch in a wire or conductor edge.
Nonvetting
A condition whereby a surface has contacted molten
solder, but the solder has not adhered to the entire
surface; basis metal remains exposed.
Orientation
The direction in which the components on a printed
board or other assembly are lined up electrically with
respect to the polarity of polarised components, with
respect to one another, and to the board.
8
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
Overheated Solder
Connection
A solder connection characterised by solder surfaces that
are dull, chalky, grainy and porous or pitted.
Peeling
Solder peeling from metallized surfaces is unacceptable
in the vertical solder joint. Peeling on the topside that
does not reach the vertical edge is not cause for
rejection.
Pinhole
A small hole occurring as an imperfection that penetrates
entirely through a layer of material.
Pit
A small hole occurring as an imperfection which does not
penetrate entirely through the foil.
Pitch
The nominal distance from center-to-center of adjacent
conductors. (Where conductors are of equal size and spacing is
uniform, the pitch is usually measured from the reference edge of
the adjacent conductor).
Preferred Solder
Connection
A solder connection that is smooth, bright and featheredout to a thin edge (This indicates proper solder flow and wetting
action). No bare lead material is exposed within the solder
connection, and there are no sharp solder protrusions or
evidence of contamination (embedded foreign material). The
contour of the lead is still visible.
Printed Board
The general term for completely processed printed circuit
and printed wiring configurations. (It includes single-sided,
double-side, and multilayer boards with rigid, flexible, and rigid-flex
base materials).
Printed Wiring
The conductive pattern intended to be formed on a
common base, to provide point-to-point connection of
discrete components, but not to contain printed
components.
Reflow Soldering
A process for joining parts by tinning the mating surfaces,
placing them together, heating until the solder fuse, and
allowing to cool in the joined position.
Rosin Solder
Connection
A solder connection that has practically the same
appearance as a cold solder connection but shows
evidence of rosin entrapped within the connection
Scratch
A narrow, usually shallow, furrow or groove on a surface.
(It is usually caused by marking or rasping the surface with a pointed
object).
9
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
Screen Printing
A process for transferring an image to a surface by
forcing suitable media through a stencil screen with a
squeegee.
Silver
A slender portion of plating (tin, tin-lead, lead, gold etc.)
overhang that is partially or completely separated from a
conductor edge.
Solder Ball
A small sphere of solder adhering to a laminate, resist or
conductor surface. (This generally occurs after wave or reflow
soldering).
Solder Bridging
Unwanted formation of a conductive path by solder
between conductors.
Solder Connection
An electrical/mechanical connection that employs solder
for the joining of two or more metal surfaces.
Solder Connection
Pinhole
A solder connection with a small hole(s) penetrating from
the surface of the solder to a void of indeterminate size
within the solder connection.
Solder Fillet
A normally concave surface of solder at the intersection
of the metal surfaces of the solder connection.
Solder Paste, Cream
A soldering material containing solder particles
suspended in flux and binders. This
material
is
deposited on the lands of surface mounted components.
Solder Spikes or
Peaks
Solder Splatter
Undesirable protrusions from a solidified solder joint.
Solder Webbing
A continuous film or curtain of solder parallel to, but not
necessarily adhering to, a surface that should be free of
solder.
Solder Wicking
The capillary movement of solder between metal
surfaces, such as strands of wire.
Solderability
The ability of a metal to be wetted by molten solder.
Soldering
A process of joining metallic surfaces with solder, without
the melting of the base material.
Surface Mount
Component (Device)
A component (device) capable of being attached to a
printed board by surface mounting.
(It may be either
leaded or leadless).
Extraneous irregular shaped solder fragments.
10
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
Surface Mounting
The electrical connection of components to the surface of
a conductive pattern that does not utilise component
holes.
Terminal
A metallic termination device used for making electrical
connectors. (See also " Solder Terminal " ).
Termination
The metallised area on a surface mounted component
body that is intended for connection to substrate.
Tinning
The application of molten solder to a basis metal to
increase its solderability.
Twist
The deformation parallel to a diagonal of a rectangular
sheet such that one of the corners is not in the plane
containing the other three corners.
Weave Exposure
A surface condition of base material in which the
unbroken fibres of woven glass cloth are not completely
covered by resin.
Weave Texture
A surface condition of base material in which the weave
pattern of glass cloth is apparent although the unbroken
fibres of the woven cloth are completely covered with
resin.
Wetting Solder
The formation of a relatively uniform, smooth, unbroken
and adherent film of solder to a basis metal:
Wicking
Capillary absorption of liquid along the fibres of the base
material. (See also " Solder Wicking " ).
11
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
COMPONENT IDENTIFICATION
Ceramic Chip Capacitor
NTC Thermistor Chip
PTC Thermistor Chip
Resistor
MELF
All components shown above should be soldered at 600oF
(330oC)
12
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Tantalum Chip Capacitor
Metalised Polyester Chip Capacitor
SIMID Chip Inductor
Chip Inductor
Minature Ferrite Inductor
Rev.A00
Inductor
All components shown above should be soldered at 650oF
(350oC)
13
Teleplan Operator Soldering & Component Placement Guidlines
PLCC (Plastic Leadless Chip Carrier)
Integrated Circuit
Proc. No:4.09.145
Rev.A00
Integrated Circuit
Optocoupler
Normal Flatpack
Butterfly Flatpack
Diode
SOT 23
Small Outline Transistor
SOT 143
Small Outline Transistor
SOT 89
Small Outline Transistor
SO 6......SO20 L
Small Outline Integrated Circuit
(SOIC)
All components shown above should be soldered at 700oF
(372oC)
14
Teleplan Operator Soldering & Component Placement Guidlines
'J' Lead Integrated Circuit
Proc. No:4.09.145
Rev.A00
'V' Lead Integrated Circuit
Gullwing Lead
All components shown above should be soldered at 700oF
(372oC)
15
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
CHIP COMPONENT PLACEMENT (Metallized end)
MAXIMUM SIDE OVERHANG
75% of the component metallization width
of each end of the component is over the
pad.
The
minimum
conductor
requirements are maintained.
spacing
PREFERRED PLACEMENT
Entire area of the component metallization
shall be over the pad with no evidence of
side or end overhang.
MAXIMUM END OVERHANG
75% of the component metallization end is
over the pad.
16
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
CHIP COMPONENT PLACEMENT (cont)
PREFERRED PLACEMENT
Entire area of the component
metallization shall be over the pad
with no evidence of side or end
overhang.
MAXIMUM ACCEPTABLE
The maximum misalignment of the
component centreline and the pad
centreline is no greater than 20% of
the component width.
The minimum conductor
requirements are maintained
spacing
REJECTABLE
The maximum misalignment of the
component centreline and the pad
centreline exceeds 20% of the
component width and / or violates the
minimum
conductor
spacing
requirements.
17
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
CHIP SOLDER COVERAGE
ACCEPTABLE
The solder fillet extends more than
25% or 0.04' (which ever is less) up the
end of the component.
At least 75% of the end metallization
width has a solder fillet. (A side fillet is
not required).
The wetting angle of the solder fillet
shall be less than 90o except when
the quantity of solder results in a
rounded contour which extends over
the edge of the pad
MINIMUM ACCEPTABLE
The solder fillet extends at least 25%
or 0.04' (which ever is less) up the end
of the component.
As a minimum, 75% of the end
metallization width has a solder fillet.
(A side fillet is not required).
REJECTABLE
The solder fillet extends greater than
25% or 0.04' up the end of the
component and encases the nonmetallization
portion
of
the
component.
18
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
CHIP ELEVATION / PARALLELISM (After Soldering)
MAXIMUM ACCEPTABLE
(SIDE VIEW)
The space between the body of the
component and the terminal areas
shall be such that contaminants do
not remain under the component
after soldering.
The
difference
between
the
thicknesses of solder under each end
of the component shall be less than
0.016' (0.4mm).
Angular
displacement
shall
not
exceed 10o
b-a & lt; =0.016' (0.4mm)
MAXIMUM ACCEPTABLE
(END VIEW)
The
difference
between
the
thicknesses of solder under each
end of the component shall be less
than 0.016' (0.4mm).
Angular displacement
exceed 10o
shall
not
19
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
MELF COMPONENT PLACEMENT
MAXIMUM SIDE OVERHANG
75% of the component metallization
width of each end of the component
is over the pad.
L=25%
PREFERRED PLACEMENT
Entire area of the component
metallization shall be centred on the
pad with no evidence of side or end
overhang.
MAXIMUM END OVERHANG
75% of the component metallization
end is over the pad.
20
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
MELF SOLDER COVERAGE
ACCEPTABLE
The solder fillet extends more than
25% or 0.04' (which ever is less) up the
end of the component.
At least 75% of the end metallization
width has a solder fillet. (A side fillet is
not required).
MINIMUM ACCEPTABLE
The solder fillet extends at least 25%
or 0.04' (which ever is less) up the end
of the component.
As a minimum, 75% of the end
metallization width has a solder fillet.
(A side fillet is not required).
21
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
LCC COMPONENT PLACEMENT
PREFERRED PLACEMENT
Each metallized castellation of the
component shall be centred on the
pad with no evidence of side or end
overhang.
MAXIMUM SIDE OVERHANG
75% of each metallized castellation
width of the component is over the
pad.
REJECTABLE
Less than 75% of each metallized
castellation width of the component is
over the pad.
22
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
LCC SOLDER COVERAGE
ACCEPTABLE
The vertical solder fillet extends up the
castellation a length equal to the
horizontal solder fillet.
MINIMUM ACCEPTABLE
Each castellation shall have a solder fillet which, as a
minimum, rises vertically above the lower edge of the outer
castellation surface.
MINIMUM ACCEPTABLE
Leadless chip carriers which have bottom
only terminations shall have a minimum
solder connection height of 0.008'
(0.2mm) unless the design effectively
compensates for the CTE (coefficient of
thermal expansion) mismatch between the
component and the printed wiring which
is less than 13 PPM
23
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
LCC SOLDER COVERAGE (Cont)
MAXIMUM ACCEPTABLE
When the solder fillet extends beyond
the side of the castellation (unless
otherwise
drawings),
specified
in
the
assembly
the adjacent solder fillets
shall not be closer than 0.01'
(0.254mm) or the minimum conductor
spacing requirements, whichever is
greater.
I I & lt; 0.01' Minimum
SOLDER CONTOUR
The wetting angle of the solder fillet
shall be less than 90o except when
the quantity of the solder results in a
rounded contour which extends over
the edge of the pad.
All connections must have evidence
of good wetting
ELEVATION
The space between the body of the component and the
terminal areas shall be such that contaminants do not
remain under the component after cleaning.
24
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
LCC ELEVATION / PARALLELISM (After soldering)
MAXIMUM ACCEPTABLE
The
difference
between
the
thicknesses of solder under each
end of the component shall be less
than 0.016' (0.4mm).
b-a & lt; =0.016' (0.4mm)
25
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
'J' & 'V' LEADS (PLCC) COMPONENT PLACEMENT
PREFERRED PLACEMENT
Each component lead shall be centred
on the pad with no evidence of side or
end overhang.
MAXIMUM SIDE OVERHANG
75% of each component lead width is
over the pad.
25% of each lead width overhangs the
pad
25% lead with overhangs maximum
26
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
'J' & 'V' LEADS (PLCC) SOLDER COVERAGE
MAXIMUM ACCEPTABLE
The solder fillet extends onto the inner
surface of the lead but does not
contact the bottom of the component.
PREFERRED
The solder fillet shall extend onto the
inner surface of the lead and covers
the entire lead width.
MINIMUM
The solder forms a fillet at least one
lead width along the curve of the 'J' or
'V' lead and covers at least 75% of the
lead width.
Note:
If the lead overhangs the pad 25% then the
fillet must cover the entire area of the lead
over the pad.
27
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
'J' & 'V' LEADS (PLCC) ELEVATION (After soldering)
PREFERRED
The component shall be mounted and
soldered approximately parallel to the
board surface.
MINIMUM ACCEPTABLE
The space between the component
body and the pad does not exceed
0.1' (2mm).
28
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
FLAT LEADS (SOIC & FLAT PACK) LEAD PLACEMENT
CONTACT LENGTH
The minimum contact length between
the lead and pad shall be one lead
width
HEEL CLEARANCE
The heel does not overhang the pad.
(Note: The heel begins where the lead begins
to curve at the lead bend)
ELEVATION
The leads may be raised off the pad a
maximum of two times the lead
thickness or 0.02' (0.5mm), whichever is
less.
29
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
FLAT LEADS (SOIC & FLAT PACK) LEAD PLACEMENT (cont)
MAXIMUM SIDE OVERHANG
Lead side overhang of the pad does
not exceed 25% of the lead width or
0.02' (0.5mm), whichever is less.
The minimum conductor spacing
requirements are maintained.
PREFERED
The lead shall have no evidence of
side or toe overhang
MAXIMUM TOE OVERHANG
Lead toe overhang of the pad does not
exceed 25% of the lead width or 0.02'
(0.5mm), whichever is less.
The minimum conductor
requirements are maintained.
spacing
30
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
FLAT LEADS (SOIC & FLAT PACK) LEAD PLACEMENT
MAXIMUM
The outline of the lead is discernible in
the solder.
The solder does not overhang the
pad.
MINIMUM
A visible fillet extends the entire length
of the lead termination and rises from
the pad to a minimum of 50% up the
side of the lead whenever the lead is
over the pad.
ACCEPTABLE
Tool marks resulting from heater bar
operation shall not be cause for
concern or rejection.
31
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
FLAT LEADS (SOIC & FLAT PACK) SOLDER COVERAGE HEEL
FILLET
MAXIMUM ACCEPTABLE
The solder fillet may extend into the
upper lead bend but shall not contact
the component body or lead seal.
The heel fillet shall be continuous
between the heel of the lead and the
pad.
PREFFERED
The heel fillet shall extend beyond
(above) the bend radius and be
continuous between the heel of the
lead and the pad but shall not extend
into the upper lead bend.
MINIMUM ACCEPTABLE
The heel fillet shall extend beyond
(above) the bend radius.
The heel fillet shall be continuous
between the heel of the lead
32
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
TANTALUM CAPACITOR COMPONENT PLACEMENT
MAXIMUM SIDE OVERHANG
75% of the component metallization
length of each end of the component is
over the pad.
The minimum conductor
requirements are maintained
spacing
PREFFERED
Entire area of the component
metallization shall be located over the
pad with no evidence of side or end
overhang.
MAXIMUM END OVERHANG
75%
of
the
component
end
metallization of the component is over
the pad.
33
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
TANTALUM CAPACITOR COMPONENT PLACEMENT (cont)
PREFERRED PLACEMENT
Entire area of the component
metallization shall be over the pad
with no evidence of side or end
overhang.
MAXIMUM ACCEPTABLE
The maximum misalignment of the
component centreline and the pad
centreline is no greater than 20% of the
component width.
The minimum conductor
requirements are maintained
spacing
REJECTABLE
The maximum misalignment of the
component centreline and the pad
centreline exceeds 20% of the
component width and / or violates the
minimum
conductor
spacing
requirements.
34
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
TANTALUM CAPACITOR SOLDER COVERAGE
ACCEPTABLE
The solder fillet extends more than
25% or 0.04' (which ever is less) up the
end of the component.
At least 75% of the end metallization
width has a solder fillet. (A side fillet is
not required).
The wetting angle of the solder fillet
shall be less than 90o except when
the quantity of solder results in a
rounded contour which extends over
the edge of the pad
MINIMUM ACCEPTABLE
The solder fillet extends at least 25%
or 0.04' (which ever is less) up the end
metallization of the component.
As a minimum, 75% of the end
metallization width has a solder fillet.
(A side fillet is not required).
REJECTABLE
The solder fillet extends greater than
25% or 0.04' up the end metallization
of the component and the wetting
angle of the solder fillet exceeds 90o.
35
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
SOT (SMALL OUTLINE TRANSISTOR) PLACEMENT
MAXIMUM SIDE OVERHANG
Lead side overhang of the pad does
not exceed 25% of the lead width or
0.02' (0.5mm), whichever is less.
The minimum conductor spacing
requirements are maintained.
MAXIMUM TOE OVERHANG
Lead toe overhang of the pad does
not exceed 25% of the lead width or
0.02' (0.5mm), whichever is less.
The minimum conductor spacing
requirements are maintained.
ELEVATION
The leads may be raised off the
pad a maximum of two times the
lead thickness or 0.02' (0.5mm),
whichever is less.
36
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
SOT (SMALL OUTLINE TRANSISTOR) SOLDER COVERAGE
MAXIMUM
The outline of the lead is discernible
in the solder.
The solder does not overhang the
pad.
MINIMUM
A visible fillet extends the entire
length of the lead termination and
rises from the pad to a minimum of
50% up the side of the lead whenever
the lead is over the pad.
ACCEPTABLE
Tool marks resulting from heater bar
operation shall not be cause for
concern or rejection.
37
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
" I " LEAD COMPONENT PLACEMENT
MAXIMUM FRONT MISALIGNMENT
The lead must be on the pad with a
minimum of 0.01' (0.254mm) front edge
clearance.
MAXIMUM SIDE MISALIGNMENT
The lead must be on the pad with a
minimum of 0.01' (0.254mm) side edge
clearance.
PREFERRED PLACEMENT
The component lead is centred on
pad.
38
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
" I " LEAD SOLDER COVERAGE
MAXIMUM ACCEPTABLE
The solder fillet is concave and
extends up the lead but does not flow
on to the upper section of the lead or
the area of the lead attachment to the
component body.
Solder does not overhang the pad.
PREFERRED
The solder fillet is smooth, continuous
and feathered to a thin edge with no
protrusions
or
evidence
of
contamination.
The outline of the lead is discernible in
the solder.
MINIMUM ACCEPTABLE
Good solder flow and wetting is
evident.
The fillet is concave in shape and
should extend at least 0.015' (0.3mm)
up the lead.
39
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
SOLDER JOINT INTEGRITY
- COLD CONNECTION (NON-WETTING)
PREFERRED
The solder is smooth, bright,
continuous and feathered to a thin
edge.
The wetting angle of the solder to the
component and the pad is less than
90o.
There is no a sharp protrusion or
evidence of contamination.
The outline of the lead (termination)
is discernible in the solder.
REJECTABLE
The solder has not flowed smoothly.
It is lumpy and piled up and does not
display complete wetting throughout
the connection.
40
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
SOLDER JOINT INTEGRITY
- ROSIN CONNECTION (NON-WETTING)
PREFERRED
The solder is smooth, bright,
continuous and feathered to a thin
edge.
The wetting angle of the solder to the
component and the pad is less than
90o.
There is no a sharp protrusion or
evidence of contamination.
The outline of the lead (termination)
is discernible in the solder.
REJECTABLE
Flux is entrapped between the lead
(termination) and the pad reducing or
preventing wetting between surfaces
to be joined.
41
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
SOLDER JOINT INTEGRITY
- OVERHEATED CONNECTION
PREFERRED
The solder is smooth, bright,
continuous and feathered to a thin
edge indicating proper flow and
wetting action.
The wetting angle of the solder to
the component and the pad is less
than 90o.
REJECTABLE
The fillet has evidence of excessive
graininess, porosity or crystalline
appearance indicated overheating of
connection during soldering.
42
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
SOLDER JOINT INTEGRITY
- NON WETTING / DEWETTING
PREFERRED
There is complete wetting or bonding
of solder to the pad and lead
(termination).
The wetting angle of the solder to the
component and the pad is less than
90o.
REJECTABLE
The solder does not completely wet
the pad or lead (termination)
because of poor solderability of the
metallic surfaces.
43
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
SOLDER JOINT INTEGRITY
- SOLDER WICKING UP LEAD
PREFERRED
The solder is smooth, bright,
continuous and feathered to a thin
edge.
The wetting angle of the solder to
the component and the pad is less
than 90o.
Outline of the lead is discernible.
The bulk of the solder remains at the
lead / pad interface.
REJECTABLE
The solder has flowed up the lead and
starved the lead / pad interface below
minimum solder coverage limits.
44
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
SOLDER JOINT INTEGRITY
- PIN HOLES / VOIDS
PREFERRED
The solder is smooth, bright,
continuous and feathered to a thin
edge.
The wetting angle of the solder to the
component and the pad is less than
90o.
REJECTABLE
The solder has flowed up the lead and
starved the lead / pad interface below
minimum solder coverage limits.
45
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
SOLDER JOINT INTEGRITY
- ICICLES
PREFERRED
The solder is smooth, bright,
continuous and feathered to a thin
edge.
The wetting angle of the solder to the
component and the pad is less than
90o.
REJECTABLE
The solder connection has projecting
points, peaks or icicles which violate
the minimum electrical spacing
requirements.
46
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
SOLDER JOINT INTEGRITY
- BRIDGING
PREFERRED
The solder is smooth, bright,
continuous and feathered to a thin
edge.
The wetting angle of the solder to the
component and the pad is less than
90o.
REJECTABLE
The solder projects beyond the pad or
lead forming a short circuit between
adjacent pads, leads or traces.
47
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
SOLDER JOINT INTEGRITY
- SOLDER BALLS / SPATTER (FOREIGN MATERIAL)
PREFERRED
No solder balls / spatter evident on
surface of board or component leads.
REJECTABLE
Solder balls / spatter evident on
surface of board or component leads.
48
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
SOLDER JOINT INTEGRITY
- LIFTED PADS, CONDUCTORS AND GROUND PLANES
PREFERRED
All
pads
and
conductors
are
completely attached to the board
surface.
REJECTABLE
Pads
have
been
partially
or
completely separated from the board
surface a distance greater than the
thickness of the pad.
Conductors and ground planes shall
not be separated either totally or
partially from the board surface.
49
Teleplan Operator Soldering & Component Placement Guidlines
Proc. No:4.09.145
Rev.A00
SOLDER JOINT INTEGRITY
- MEASELS (DELAMINATION)
PREFERRED
Printed circuit board has no evidence
of measles, blisters or delamination.
REJECTABLE
Evidence of measled area between
two conductors on the same plane at
different electrical potential which
reduces the unmeasled area to less
than 50% of the minimum design
electrical spacing.
50

" J" Is For Judgment Pdf free. download full


Solder instructions.rar > Service Profile for Lead Free.doc

" J" Is For Judgment Pdf Free Download Torrent

Service Profile
for
Lead Free
Published by: BLC MMFD Service
Initial issue: 2004/06/17
Revision: 2004/08/09
Revision: 2004/12/07 (final version)
Revision: 2005/01/19 (TPM EMEA version)
Table of Content
European Community
legislation..........................................................3
Compatibility of leaded and lead-free
component.....................................6
Lead-free product
identification..........................................................
7
Lead-free product repair
instruction......................................................7
Lead-free solder joint
externals..........................................................11
Soldering quality
inspection..............................................................
13
Lead-free repair process
assessment.....................................................21
1. European Community legislation
RoHS directive 2002/95/EC & WEEE directive 2002/96/EC: both ratified for
legislation by the Council at 27-01-2003.
RoHS compliant, for components and boards, means that Pb and other
materials banned in the directive, are not present in components or
subsystems, or if present, are covered under a legislative exemption.
The LF alloy used shall have & lt; 1000 ppm Pb (0.1wt%)
The China government has announced to copy exact the legislation
requirements and planning of RoHS in the EU.
2. Compatibility of leaded and lead-free component
In general we do not change our 12NC's only for LF reasons.
For forwards and backwards compatible, the old non-LF component can be
used in the LF soldering process and the new LF version can be used in
the leaded soldering process. For example, resistors, chip capacitors.
There are some exceptions:
For components which are not backwards and forwards (group 3)
compatible, we will create new 12 NC's. For example: BGA's with LF
solder balls can not be used in a leaded process because the temperature
is too low.
For components which are not forwards compatible (group 2), we will
create new 12 NC's for the replacement LF component. For example:
Connectors from JST were not resistant to our LF soldering temperature
and therefore the supplier created new components with improved
material.
3. Lead-free product identification
You can identify lead-free product by lead-free logo on PCB.
4. Lead-free product repair instruction
4.1 Use only lead-free Solder Alloy 0622 149 00106(1.2mm SAC305) or 0622
149
00108(1.0mm SAC305).
Remark: For lead free soldering material, please visit HYPERLINK
" http://www.alphametals.com " www.alphametals.com website for details.
4.2 Use only adequate solder tools applicable for lead-free
soldering-tin. The solder tool
must be able to reach at least a solder-temperature of 400°C, to
stabilize the adjusted
temperature at the solder-tip and to exchange solder-tips for different
applications.
Small Passives/Actives to be removed with thermal tweezers
Automated system for IC and BGA repair (Microscope, Camera, Beam split
optics, Computer, Programmer, Heat controllers, Vacuum system, Laser
pointer)
Solder Hand-Tool (Adjustable in temperature height, Temperature shall be
held constant, Flexible tips)
4.3 Adjust your solder tool so that a temperature around 360°C -
380°C is reached and
stabilized at the solder joint. Heating-time of the solder-joint should
not exceed ~ 4
sec. Avoid temperatures above 400°C otherwise wear-out of tips will
rise drastically
and flux-fluid will be destroyed.
Corrosion of Tool-Spikes can be avoided when using SAC305 and a
temperature of less than 400°C.
4.4 Mix of lead-free solder-tin/parts with leaded soldering-tin/parts
is possible but not
recommended. If not to avoid clean carefully the solder-joint from old
tin and re-
solder with new tin.
Clean carefully the solder joint from solder alloy before re-soldering
4.5 Use only original spare-parts listed in the Service-Manuals.
Standard-material
(consumables) can also be purchased at external companies.
4.6 Special information for lead-free BGA-ICs: this ICs will be
delivered in so-called
'dry-packaging' to protect the IC against moisture and with
lead-free logo on it. This
packaging may only be opened shortly before it is used (soldered).
Otherwise the
body of the IC gets 'wet' inside and during the heating time the
structure of the IC
will be destroyed due to high (steam-)pressure. If the packaging was
opened before
usage the IC has to be heated up for some hours (around 90°C) for
drying (Take
attention for ESD-protection!).
Dry pack Lead Free components
4.7 Requirements for stations:
? Suitable for all present day components, including LGA
? Maximum temperature setting of tools
? Temperature controlled. Ideally, the tools should have no
temperature overshoot.
? Fast thermal response. This improves the consistency of temperature
control and heat
delivery.
? Temperature ramp up adjustable / controlled
? Monitoring facilities for temperature during rework
? Bottom heater, adjustable in dimensions ( also for large sized
substrates applicable )
? Split view optics for component alignment
? Component size minimal up to 40x40mm
? Simulate reflow profile as close as possible
? Suitable for lead free applications
? No damage to adjacent components
? Easy operation
? Flexibility ( easy and short change over to other components )
5. Lead-free solder joint externals
SAC solder joints look different
Grainy surface appearance
Striation marks
Lead Free SnAgCu solder with Lead Free Ball Grid Array component has a
less shiny and more cratered solder joint appearance.
Lead-free SnAgCu soldered lead-free resistor component has less wetting
than tin-lead soldered component
6. Soldering Quality Inspection
6.1 Good soldering figure for axial insertion
6.2 Good soldering figure for radial insertion
6.3 Good soldering figure for plain holes
6.4 Soldering failure inspection figure
6.4.1 Solder deformation
The visual fatigue level rating of solder joints are split up in 5
classification:
Rating A: No deformation
Rating B: Slight deformation
Rating C: Crack & lt; 180 degree
Rating D: Crack between 180~360 degree
Rating E: Complete crack 360 degree
Visual fatigue rating figure as bellowing:
6.4.2 Short circuit
6.4.3 Splashing joints
6.4.4 Solder balls
6.4.5 Lead not visible
6.4.6 Holes after Re-Soldering
6.4.7 Dewetting
6.4.8 Incomplete solder joints
6.5.1 Incomplete soldering for circular shape
6.5.2 Incomplete soldering for elliptical shape(holes not in middle)
6.5.3 Incomplete soldering for elliptical shape(holes in middle)
6.5.4 Incomplete soldering for wing shape
7. Lead-free repair process assessment
Please make sure your TPMs are ready for lead-free repair process. Below
is a check list for you to assess TPMs.
Item Check Item
1 Is sufficient information/training provided to the relevant technical
people OR if there is evidence to show that these people have the
required knowledge to implement and sustain lead free soldering in the
workshop?
2 Are operators trained about lead free soldering, including visual
assessment of LF solder joints?
3 Are all visual aids updated to reflect lead-free changes?
4 Are the soldering irons capable to process lead free project? (For
instance, temperature stability, maximum temperature).
5 Is there already identified / controlled solder (solder paste, solder
bar, solder wire,etc) for lead free process, and there is evidence for
qualification? Please specify selected materials
6 Are other relevant indirect material evaluated with evidence to show
compliance to the lead free soldering process?
7 Is there evidence to show that the soldering profiles are determined
with consideration to suppliers' (component, solder, flux, etc)
recommendation?
8 Is solder joint quality evaluated against workmanship standard? Which
criteria are applied? What is the sample size and judgement criteria?
9 Are other quality aspects evaluated?
Solder residues : solder balls, solder splashes
PCB discolouration
electrical insulation
corrosion risk, electro-migration
component melting
board warpage
component mounting
laminate delamination
.
/
0
1
5
6
?
?
0
1
?
?
?
jv
'
'
8Are Lead Free process capability/process control/ machine-process
maintenance in place?
17 Are conventional and LF assembly lines clearly differentiated on the
shop floor?
PAGE 2 - NUMPAGES 20
Lead pin
Copper foil
PCB basic material
Solder
Lead not protrude outside the solder, contained in solder
skin of contact wire
solder
alloy
printed wire
on PCB
contact-wire
PCB
PCB
Component, produced
- with Pb or
- without Pb